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Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation
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[BCM] [ASMPT] [E3] [BIA] [T3] [CBF] [2] Manufacturing and Assembly Operations

Part 5: Inter-dependenciesASMPT Logo White Background

 

Manufacturing and assembly operations at ASMPT are highly complex and interconnected, involving multiple business units, technology platforms, and external partners across the semiconductor and electronics supply chain.

The effectiveness of these operations depends not only on internal coordination across specialised processes but also on timely inputs from suppliers, equipment vendors, and outsourced partners.

Inter-dependencies can be categorised as internal (between ASMPT’s own business units), external (with suppliers, vendors, and partners), and by direction of dependency:

  • Upstream dependency: Inputs or resources required before a process can proceed.
  • Downstream dependency: Outputs delivered to subsequent processes or customers.
  • Mutual dependency: Continuous exchange of inputs and outputs between two or more parties.

Understanding and mapping these inter-dependencies is critical for business continuity management under ISO 22301.

 

 

Part 6: Vital Records

Vital records are the essential documents, data, and information that enable an organization to maintain continuity of operations during and after a disruption.

For ASMPT’s Manufacturing and Assembly Operations (CBF-2), these records safeguard the ability to resume production, meet customer commitments, and comply with regulatory requirements.

In the context of semiconductor and electronics assembly, vital records extend beyond conventional financial or HR documentation.

They include production specifications, process recipes, machine calibration data, system integration protocols, and quality control certifications.

These records must be protected, retrievable, and secured in multiple formats and locations to mitigate operational risk.

The following table outlines the vital records required for each Sub-CBF under CBF-2 Manufacturing and Assembly Operations, specifying their description, media type, location, and custodianship.

Dr Goh Moh Heng
Business Continuity Management Certified Planner-Specialist-Expert
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Part 5: Inter-dependencies
CBF-2 Manufacturing and Assembly Operations

Manufacturing and assembly operations at ASMPT are highly complex and interconnected, involving multiple business units, technology platforms, and external partners across the semiconductor and electronics supply chain.[BCM] [ASMPT] [E3] [BIA] [T3 [CBF] [2] Manufacturing and Assembly Operations

The effectiveness of these operations depends not only on internal coordination across specialised processes but also on timely inputs from suppliers, equipment vendors, and outsourced partners.

Inter-dependencies can be categorised as internal (between ASMPT’s own business units), external (with suppliers, vendors, and partners), and by direction of dependency:

  • Upstream dependency: Inputs or resources required before a process can proceed.
  • Downstream dependency: Outputs delivered to subsequent processes or customers.
  • Mutual dependency: Continuous exchange of inputs and outputs between two or more parties.

Understanding and mapping these inter-dependencies is critical for business continuity management under ISO 22301.

It ensures that any disruption in one sub-CBF does not cascade into prolonged downtime across ASMPT’s manufacturing ecosystem.

Table: Inter-dependencies for 
CBF-2 Manufacturing and Assembly Operations

 

Sub-CBF Code

Sub-CBF 

Name of Business Unit or Vendor/ Supplier/ Outsource Partner

Type of Depend-ency - Internal

Type of Depend-ency - External

Depend-ency Direction

Description of the Nature of Dependency

1.1

Wafer-Level Preparation & Substrate Processing

ASMPT Materials Engineering, Wafer & Substrate Suppliers

Yes

Yes

Upstream

Relies on material engineering for specifications and on suppliers for high-quality wafers and substrates.

1.2

Die Attach & Flip-Chip Bonding

ASMPT Bonding Systems Unit, Adhesive & Solder Paste Vendors

Yes

Yes

Upstream & Downstream

Internal bonding systems design integration; external adhesives and solders required for attachment processes.

1.3

Deposition & Metallization

Thin-Film Equipment Vendors, ASMPT Equipment Engineering

Yes

Yes

Mutual

Equipment calibration (internal) and external thin-film equipment vendors ensure precise metallization processes.

1.4

Molding, Trimming & Forming

Packaging Unit, Mold Compound Suppliers, Outsourced Mold Services

Yes

Yes

Downstream

Internal packaging unit alignment and external mold compound supply critical for product encapsulation.

1.5

Assembly & Sensor Integration

ASMPT Sensor Division, Third-Party Sensor Suppliers

Yes

Yes

Mutual

Internal assembly teams align with ASMPT’s sensor design; external suppliers provide specialized sensor chips.

1.6

In-Line System Integration & Automation

ASMPT Automation Unit, Robotics Vendors

Yes

Yes

Downstream

Dependent on internal automation expertise and external robotics vendors for system-level integration.

1.7

Smart Factory Integration & Open Automation

ASMPT Digital Transformation, IoT Platform Vendors

Yes

Yes

Mutual

Requires integration of internal digital systems and external IoT platforms for seamless factory operations.

1.8

Process Monitoring, MES & Data Analytics

ASMPT IT & Data Analytics, MES Software Vendors

Yes

Yes

Upstream & Downstream

Internal IT ensures MES deployment, while external vendors provide software support and updates.

1.9

Quality Assurance & End-of-Line Handling

QA Unit, Testing Equipment Vendors, Logistics Partners

Yes

Yes

Downstream

Internal QA ensures standards; external test equipment vendors and logistics partners enable product shipment
 
 

This table distinguishes internal vs. external dependencies, shows whether each is upstream, downstream, or mutual, and explains the nature of dependency clearly.

Summing Up ... Part 5

The inter-dependencies of SMFSC’s Casework & Counselling function highlight the organisation’s reliance on a network of internal teams and external stakeholders to deliver effective client outcomes.

These linkages are not only operational but also strategic, as they reinforce the centre’s commitment to holistic care, regulatory compliance, and community collaboration.

Understanding whether a dependency is upstream, downstream, or mutual allows SMFSC to prioritise continuity planning, allocate resources, and strengthen coordination with critical partners.

Ultimately, recognising and managing these inter-dependencies enhances resilience, ensures service continuity during disruptions, and reinforces SMFSC’s role as a trusted provider of essential social support services in the community.

 

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Part 6: Vital Records

Part 6_ Vital Records

Part 6: Vital Records
CBF-2 Manufacturing and Assembly Operations

Vital records are the essential documents, data, and information that enable an organisation to maintain continuity of operations during and after a disruption.

For ASMPT’s Manufacturing and Assembly Operations (CBF-2), these records safeguard the ability to resume production, meet customer commitments, and comply with regulatory requirements.

In the context of semiconductor and electronics assembly, vital records extend beyond conventional financial or HR documentation.

They include production specifications, process recipes, machine calibration data, system integration protocols, and quality control certifications.

These records must be protected, retrievable, and secured in multiple formats and locations to mitigate operational risk.

The following table outlines the vital records required for each Sub-CBF under CBF-2 Manufacturing and Assembly Operations, specifying their description, media type, location, and custodianship.

Vital Records Table

 

Sub-Critical Code

Sub-CBF

Description of Vital Records

Media Type

Location

In Whose Care

1.1

Wafer-Level Preparation & Substrate Processing

Process design specifications, wafer handling procedures, substrate recipes, and equipment calibration records

Electronic (ERP/MES), Hard Copy

Data Centre, Engineering Office

Process Engineering Manager

1.2

Die Attach & Flip-Chip Bonding

Bonding parameters, die attach programs, flip-chip alignment profiles, and machine qualification logs

Electronic (MES), Hard Copy

Cleanroom Server, Production Office

Production Supervisor

1.3

Deposition & Metallisation

Deposition recipes, metallisation thickness records, chemical usage logs, equipment safety certificates

Electronic (LIMS, MES), Hard Copy

Data Center, Chemical Storage Facility

Materials Scientist / Facilities Manager

1.4

Moulding, Trimming & Forming

Mould designs, trimming tool specifications, forming process settings, and maintenance logs

Electronic CAD files, Hard Copy

Tooling Room, Design Server

Tooling Engineer

1.5

Assembly & Sensor Integration

Assembly blueprints, integration guidelines, sensor calibration data,and  customer assembly specifications

Electronic (ERP/MES), Hard Copy

Assembly Floor, Customer Document Repository

Assembly Engineering Lead

1.6

In-Line System Integration & Automation

PLC programming files, automation workflows, robotics configuration records, system integration diagrams

Electronic (SCADA, PLC files), Hard Copy

Automation Lab, Control Room

Automation Systems Engineer

1.7

Smart Factory Integration & Open Automation

Smart factory architecture documentation, IoT sensor network maps, API interface records

Electronic (Cloud Storage, MES), Hard Copy

IT Data Center, Cloud Repository

Digital Transformation Manager
1.8

Process Monitoring, MES & Data Analytics

MES configuration, process monitoring dashboards, analytics algorithms, real-time performance data logs

Electronic (MES, Database)

Data Center, Backup Data Repositories

IT Applications Manager
1.9

Quality Assurance & End-of-Line Handling

Test protocols, inspection checklists, defect tracking logs, certification reports (ISO, customer-specific)

Electronic (QMS, MES), Hard Copy

QA Office, Secure Archive

Quality Assurance Manager
 
 

Summing Up ... Part 6

Vital records serve as the backbone of ASMPT’s Manufacturing and Assembly Operations (CBF-2), ensuring that essential production processes can be restarted swiftly and accurately following a disruption.

By safeguarding key documents—ranging from wafer specifications to automation workflows—ASMPT strengthens its resilience against operational downtime, regulatory non-compliance, and reputational risks.

Proper custodianship, redundancy in storage, and clear assignment of responsibility guarantee that vital records remain secure, accessible, and usable when needed most.

In line with ISO 22301 best practices, this structured management of vital records enables ASMPT to uphold both business continuity and its commitment to customers in the highly demanding semiconductor industry.

 

Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation
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 CBF-2 Manufacturing and Assembly Operations
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