[BCM] [ASMPT] [E3] [BIA] [T1] [CBF] [2] Manufacturing and Assembly Operations

[BCM] [ASMPT] [E3] [BIA] [T1] [CBF] [2] Manufacturing and Assembly Operations

[BCM] [ASMPT] [E3] [BIA] [T1] [CBF] [2] Manufacturing and Assembly Operations

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Part 1: Identification of Business Functions

CBF-2 Manufacturing and Assembly Operations

Description and MBCO for CBF-2: Manufacturing and Assembly Operations

Summing Up ... for Part 1

Part 2: Impact Area Of Business Functions

CBF-2 Manufacturing and Assembly Operations

Detailed Impact Area Assessment for CBF-2: Manufacturing and Assembly Operations

Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation

Part 1: Identification of Business Functions

CBF-2 Manufacturing and Assembly Operations

Description and MBCO for CBF-2: Manufacturing and Assembly Operations

Summing Up ... for Part 1

Part 2: Impact Area Of Business Functions

CBF-2 Manufacturing and Assembly Operations

Detailed Impact Area Assessment for CBF-2: Manufacturing and Assembly Operations

Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation

Part 1: Identification of Business Functions

CBF-2 Manufacturing and Assembly Operations

Description and MBCO for CBF-2: Manufacturing and Assembly Operations

Summing Up ... for Part 1

Part 2: Impact Area Of Business Functions

CBF-2 Manufacturing and Assembly Operations

Detailed Impact Area Assessment for CBF-2: Manufacturing and Assembly Operations

Business Continuity Management Certified Planner-Specialist-Expert

Business Continuity Management Certified Planner-Specialist-Expert

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[Business Impact Analysis] [Critical Business Function] [T1] Part 1

A BIA report CGC

For ASMPT, a global leader in semiconductor and electronics manufacturing solutions, Manufacturing and Assembly Operations form the backbone of its value creation.

This function ensures that precision, scalability, and technological innovation converge to deliver reliable products to the market.

Given ASMPT’s critical role in enabling semiconductor and electronics supply chains, any disruption in this function can significantly impact customer commitments, production schedules, and the wider ecosystem.

The Minimum Business Continuity Objective (MBCO) for each Sub-CBF establishes the minimum acceptable level of operation that ASMPT’s business units must maintain during a disruption.

While the corporate MBCO defines resilience expectations at the group level, the business unit (BU) MBCO tailors those requirements to specific operational realities such as product lines, production capacities, or geographical sites.

This alignment ensures that ASMPT can sustain essential outputs, uphold customer trust, and resume full operations within an acceptable timeframe.

Sub-CBF Code	Sub-CBF	Description of CBF	Business Unit Minimum Business Continuity Objective (MBCO)
CBF-2.1	Wafer-Level Preparation & Substrate Processing	The initial stage involves wafer dicing, substrate cutting, cleaning, and preparation for assembly.	Ensure minimum production capacity to support critical wafer lots for high-priority customers within 48 hours of disruption.
CBF-2.2	Die Attach & Flip-Chip Bonding	The core process of attaching semiconductor die to substrates using advanced bonding methods.	Maintain 30–40% bonding throughput to fulfil essential production commitments within 72 hours.
CBF-2.3	Deposition & Metallization	Thin-film deposition, plating, and metallization to create electrical interconnections.	Sustain essential metallization capacity for critical components within 3 days.
CBF-2.4	Moulding, Trimming & Forming	Encapsulation and shaping processes ensure product durability and precision.	Restore moulding and trimming for priority product families within 5 days to avoid production bottlenecks.
CBF-2.5	Assembly & Sensor Integration	High-precision assembly and integration of MEMS, sensors, and optoelectronic devices.	Maintain essential assembly output to meet key customer requirements within 5 days.
CBF-2.6	In-Line System Integration & Automation	Integrating automation for seamless, high-speed assembly and handling.	Retain baseline automated production capacity for critical lines within 72 hours.
CBF-2.7	Smart Factory Integration & Open Automation	Advanced Industry 4.0 initiatives, including AI-driven and interconnected automation.	Ensure minimal smart-factory capabilities remain online to support continuity of core manufacturing systems within 1 week.
CBF-2.8	Process Monitoring, MES & Data Analytics	Use of MES (Manufacturing Execution System), sensors, and analytics for real-time monitoring.	Maintain critical MES access and data analytics dashboards within 24 hours to ensure visibility and control.
CBF-2.9	Quality Assurance & End-of-Line Handling	Inspection, reliability testing, and final product handling before shipment.	Restore critical quality checks and final packaging processes within 48 hours to prevent customer delivery delays.

This table reflects the differentiated recovery timeframes across sub-CBFs, consistent with the BCM Institute’s framework, where MBCO for each business unit is distinct from the corporate-wide MBCO.

Manufacturing and Assembly Operations (CBF-2) are not only central to ASMPT’s ability to deliver on its business promises but also vital to maintaining global supply chain stability.

The breakdown of Sub-CBFs highlights the complex, interconnected nature of ASMPT’s production ecosystem, where each process stage contributes to overall output reliability.

By aligning business unit MBCOs with ASMPT’s corporate resilience goals, the organisation ensures that even in times of disruption, it can sustain essential operations, protect its customer relationships, and gradually scale back to full production.

This structured approach to continuity planning enables ASMPT to uphold its reputation as a trusted global partner in the semiconductor and electronics industry.

[Business Impact Analysis] [Critical Business Function] [T1] Part 2

Manufacturing and assembly operations represent the backbone of ASMPT’s value creation, directly contributing to customer delivery, revenue realisation, and market competitiveness.

Any disruption within these operations has a cascading effect on multiple dimensions, including financial performance, operational continuity, workforce productivity, compliance, and customer trust.

In alignment with ISO 22301 and BCM Institute’s framework, understanding the impact areas of these critical processes is essential for quantifying potential risks and ensuring that the Minimum Business Continuity Objective (MBCO) is safeguarded.

The following section maps each sub-critical business function (Sub-CBF) under CBF-2 Manufacturing and Assembly Operations to their respective impact areas, financial implications, MBCO considerations, and remarks.

Sub-CBF Code	Sub-CBF	Impact Area	Financial Impact – Monetary Loss (Estimated)	Financial Impact – Calculation of Monetary Loss (Formula)	Impact on MBCO – Affect MBCO	Impact on MBCO – Impact	Remarks – Description
CBF-2.1	Wafer-Level Preparation & Substrate Processing	Production capacity, Customer delivery, Quality	High – millions in lost revenue per day of downtime	(Daily Output × Average Selling Price) – (Salvage Value of WIP)	Yes	Severe delays in production throughput	Essential for preparing substrates; failure halts all downstream processes.
CBF-2.2	Die Attach & Flip-Chip Bonding	Product integrity, Yield, Customer trust	High – direct scrap costs + lost sales	(No. of Units × Cost per Unit) + (Revenue Loss from Missed Orders)	Yes	High disruption to assembly lines	Critical for semiconductor assembly; precision failures cause significant yield loss.
CBF-2.3	Deposition & Metallisation	Equipment downtime, Quality compliance	Medium to High – costly rework & downtime	(Hourly Downtime × Machine Cost per Hour) + (Scrap Rate × Material Cost)	Yes	Impacts process stability	Affects electrical performance; downtime creates cascading quality issues.
CBF-2.4	Molding, Trimming & Forming	Product quality, Compliance, Customer returns	Medium – replacement & warranty costs	(Defective Units × Replacement Cost) + (Warranty Claims)	Yes	Impacts customer satisfaction & regulatory compliance	Direct link to product reliability and customer perception.
CBF-2.5	Assembly & Sensor Integration	Output volume, Market commitments	High – order backlog and penalties	(Unfulfilled Orders × Contract Penalty Rate) + (Revenue Loss)	Yes	Major bottleneck if disrupted	Core assembly stage; disruption impacts shipment schedules.
CBF-2.6	In-Line System Integration & Automation	Efficiency, Productivity, Cycle Time	Medium – efficiency loss, increased costs	(Lost Output per Hour × ASP) + (Extra Labor Cost)	Yes	Reduced efficiency, slower turnaround	Automation critical for throughput and cost optimization.
CBF-2.7	Smart Factory Integration & Open Automation	Digital resilience, Innovation capacity	Medium – system downtime and cyber risks	(Downtime Hours × Revenue per Hour) + (IT Recovery Costs)	Yes	Affects long-term digital MBCO	Disruption impacts ASMPT’s Industry 4.0 strategy.
CBF-2.8	Process Monitoring, MES & Data Analytics	Data accuracy, Operational visibility	Medium – misinformed decisions, process loss	(Downtime Hours × Average Daily Revenue) + (Rework Cost from Errors)	Yes	Slower response to incidents	MES is vital for monitoring yield and scheduling.
CBF-2.9	Quality Assurance & End-of-Line Handling	Customer satisfaction, Compliance	High – recalls, reputational damage	(Defective Shipments × Recall Cost per Unit) + (Brand Loss Estimation)	Yes	Critical for maintaining compliance and trust	QA ensures delivery of defect-free, compliant products.

ASMPT’s Manufacturing and Assembly Operations (CBF-2) encompass highly interdependent processes that collectively ensure product integrity, operational efficiency, and market leadership.

Disruptions at any Sub-CBF level not only generate substantial financial losses but also compromise compliance, brand reputation, and customer confidence.

Through the mapping of impact areas, monetary implications, and MBCO considerations, ASMPT gains a structured understanding of potential vulnerabilities.

This structured assessment enables management to prioritise recovery strategies, allocate resources effectively, and align mitigation efforts with both regulatory standards and strategic resilience goals.

Ultimately, safeguarding ASMPT’s manufacturing and assembly operations ensures that the organisation sustains its competitive edge, maintains customer commitments, and achieves resilience in the face of disruptions.

To learn more about the course and schedule, click the buttons below for the BCM-300 Business Continuity Management Implementer [BCM-3] and the BCM-5000 Business Continuity Management Expert Implementer [BCM-5].



	Please feel free to send us a note if you have any questions.

Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation

eBook 3: Starting Your BCM Implementation

CBF-2 Manufacturing and Assembly Operations

BIAQ T1

BIAQ T2

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