[BCM] [ASMPT] [E3] [BIA] [DP] [CBF] [2] Manufacturing and Assembly Operations

Part 2: Identification of Detailed Processes (Sub-CBF) of the Critical Business Functions for ASMPT

CBF-2: Manufacturing and Assembly Operations

Manufacturing and Assembly Operations (CBF-2) form the backbone of ASMPT’s ability to deliver world-class semiconductor packaging and assembly equipment.

As a global leader in advanced electronics manufacturing, ASMPT integrates precision engineering, smart automation, and data-driven processes to ensure high-volume, high-accuracy, and resilient operations.

Within the context of Business Continuity Management (BCM), this function is critical because any disruption to wafer preparation, die bonding, metallisation, molding, or final system integration can have significant downstream effects—not only on ASMPT’s customers but also on the wider semiconductor ecosystem that depends on uninterrupted supply.

To address this, ASMPT’s Manufacturing and Assembly Operations are structured into detailed business processes, or Sub-CBFs, that ensure efficiency, scalability, and operational resilience.

These processes span the entire value chain, from wafer-level substrate preparation to end-of-line traceability and quality assurance.

By embedding smart factory technologies, advanced automation, and Manufacturing Execution Systems (MES), ASMPT ensures that these processes are not only efficient but also adaptable in the face of emerging risks.

The following sections outline the Sub-CBFs that make up this critical business function and illustrate how they contribute to sustaining business continuity.

ASMPT’s Semiconductor Solutions division designs and delivers a full spectrum of assembly and packaging equipment—ranging from bonding and moulding to complete in-line systems for microelectronics, photonics, optoelectronics, and more.

This includes specialised product lines such as:

• AMICRA: ultra-high-precision die attach and flip-chip bonding (±0.2 µm accuracy) 
• ALSI: multi-beam laser dicing and grooving—high-productivity, low-thermal-impact technology 
• NEXX: advanced packaging deposition equipment (PVD, ECD) 
• AEi: automated camera and sensor assembly and test systems 

As such, Manufacturing & Assembly Operations (CBF-2) likely encompasses end-to-end processes: from wafer-level preparation to final package assembly and integration into automated production lines.

Detailed Business Processes (Sub-CBFs) for CBF-2

These are the key sub-functions (Sub-CBFs) essential to ensuring business continuity in ASMPT’s manufacturing and assembly operations:

Wafer-Level Preparation & Substrate Processing

• Laser dicing & grooving (via ALSI capabilities)
• Precision surface preparation and substrate conditioning
• Yield monitoring and defect detection at early stages

Die Attach & Flip-Chip Bonding

• Ultra-precision placement of dies using AMICRA systems (±0.2 µm)
• Flip-chip and die bonding aligned to demanding tolerances (e.g., Eagle 60’s 35 µm pitch) 

Deposition & Metallisation

• Sputtering (PVD) and plating (ECD) of substrates for advanced packaging (via NEXX) 
• Ensuring adhesion, overlay accuracy, and process uniformity

Molding, Trim & Form

• Integration of post-bonding operations: molding, trimming leads, forming for final packages

Assembly & Sensor Integration

• Automated camera/sensor assembly and testing (AEi segment) 
• Alignment calibration, functional testing, quality validation

In-line System Integration & Automation

• Construction of fully integrated in-line systems combining bonding, moulding,and  trimming operations 
• Ensuring seamless flow across processes—controlled by upstream/downstream connectivity and standardised protocols

Smart Factory Integration & Open Automation

• AIoT-enabled smart lines, embedding AI-driven predictive maintenance, quality inference, and process tweaking 
• Use of Open Automation frameworks for modular, manufacturer-independent integration and flexibility 

Process Monitoring, Data Analytics & MES

• Integration of Critical Manufacturing MES for operations management 
• Advanced analytics, real-time monitoring, traceability and optimisation via ASMPT’s software suite (e.g. WORKS)   

Quality Assurance, Traceability & End-of-Line Handling

• High-speed placement systems (e.g., SIPLACE TX with Tray Unit) enabling automated handling of odd-shaped components, full traceability, and audit readiness 
• Integration into SMT lines with traceability, data capture, and post-placement quality inspection

Examples: How These Sub-CBFs Manifest at ASMPT

• Die bonding precision: AMICRA’s ±0.2 µm placement accuracy ensures tight tolerances for advanced IC packaging 
• Laser grooving efficiency: ALSI’s multi-beam laser dicing enables high throughput with minimal thermal damage 
• Advanced metallisation: NEXX enables wafer and panel-level deposition through sputtering and plating—key to modern packaging 
• Sensor module assembly: AEi solutions handle alignment and testing for photonics/optics modules 
• Traceable end-of-line: SIPLACE TX with Tray Unit automates OSC processing, recording full components and batch history 
• Smart factory backbone: AIoT and Open Automation allow lines to self-monitor, learn, adapt, and integrate third-party systems flexibly 
• MES & analytics: The Critical Manufacturing MES and ASMPT’s WORKS suite support operational visibility, KPI tracking, and proactive process control 

Detailed Sub-Functions of CBF-2: Manufacturing and Assembly Operations

Summing Up ...

For ASMPT, CBF-2: Manufacturing & Assembly Operations spans a comprehensive set of connected, continuity-critical functions—from wafer handling to end-of-line packaging—with highly specialised tooling (ALSI, AMICRA, NEXX, AEi) and deep integration via automation, AI, and MES systems.

Each Sub-CBF is vital to maintaining resilient, efficient, high-quality operations in semiconductor assembly and packaging.

The Manufacturing and Assembly Operations of ASMPT SEMI Solutions are a cornerstone of its business continuity strategy, representing a tightly integrated set of processes that enable the organisation to maintain quality, speed, and resilience in semiconductor equipment production.

Each Sub-CBF—whether wafer preparation, precision die attach, deposition, moulding, or automation—plays an essential role in ensuring that disruptions are minimised and recovery can be achieved swiftly when challenges arise.

By leveraging advanced automation, AIoT-driven smart factory concepts, and robust MES platforms, ASMPT is able to reinforce its resilience while supporting the evolving needs of its customers in a highly competitive and technologically dynamic market.

Ultimately, the strength of ASMPT’s business continuity in CBF-2 lies in its ability to integrate precision engineering with flexibility, ensuring that manufacturing and assembly operations continue seamlessly under both normal and adverse conditions.

Resilient Operations at ASMPT: A Guide to ISO 22301 BCM Implementation
eBook 3: Starting Your BCM Implementation
CBF-2 Manufacturing and Assembly Operations
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More Information About Business Continuity Management Courses

To learn more about the course and schedule, click the buttons below for the  BCM-300 Business Continuity Management Implementer [BCM-3] and the BCM-5000 Business Continuity Management Expert Implementer [BCM-5].

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